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Contact Plating
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CONTACT PLATING

TOTAL AREA GOLD PLATING

SUN’s total area contact plating is in full compliance with MIL-G-45204 as specified by MIL-C-28859 . Type 614 plating meets the detailed requirements of MIL-G-45204, Type II, grade C, Class 1.

 

CONTACT PLATING QUALITY CONTROL

Because it is a major determinant of the long-term reliability and performance of the connection, contact plating, including MISER gold processing, requires a high level of plating technology, stringent process control, and the detailed quality inspection procedures. SUN meets these requirements with a plating facility that is specifically designed to process and inspect the wide variety of metals utilized in Backplane interconnection systems.

Each lot of plated contacts must pass a rigid quality inspection examination that uses both x-ray fluorescence and beta ray back-scatter techniques to determine plating thickness. In addition, the inspection procedure requires conformance to criteria which evaluate porosity, solderability, adhesion, plating defects, and surface preparation. Scanning electron microscope inspection is available for special analyses. A record of inspection results is provided by maintaining the lot sample, specimens, and data for a minimum of two years.

POROSITY TESTING

Porosity in Electro-gold plating is characterized by interstitial voids or discontinuities whose magnitude depends upon such variables as surface roughness bath contamination and the deposition process and process control. There are several porosity tests used to evaluate contact surface plating. Perhaps the best known and most generally used is that specified by Western Electric. In this test, the sample contacts are placed in a desiccator and subjected to fumes from concentrated nitric acid for one hour. The contacts are then baked in an oven at 105 degrees C for one-half hour. Contacts are rejected if they show any evidence of blue-green corrosion (copper nitrite) or surface blisters when examined under 20X magnification.

 

TOTAL AREA GOLD PLATING

   
GOLD
THICKNESS
NICKLE
THICKNESS
Type
No.
Order by
Suffix No.
Micro-inches
(microns)
Micro-inches
(microns)
614
-614
50 (1.27 ) (min.)
70 (1.78) (max.)
100 ( 2.54) (min.)
250 (6.35) (max.)